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印刷機/Automatic Screen Printer
產品詳細
整機參數 /Machine Specifications:
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設備外形尺寸/Equipment Dimensions (mm)
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WxLxH:800x1400x1500
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設備正壓/Positive Pressue (Kpa)
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0.4~0.6
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設備負壓/Negative Pressure (-Kpa)
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0.1~0.4
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設備總功率/Total Power(KW)
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2.5kw
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技術參數Technical Specifications:
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硅片尺寸/Wafer Size(mm)
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125x125,156x156或156x156,210x210
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硅片厚度 /Wafer Thickness(μm)
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100~400
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產能/小時(理論值)/Capacity/ hour（theoretical value）
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單臺印刷機/Singel printer:1100(1200)
雙拼印刷機/Double printer:2000(2200)
三拼印刷機: Three layer printer：2800(3100)
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印刷精度/Printing Accuracy(mm)
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±0.025
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技術特點/Features:
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具體細項/Item
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控制方式/Control mode
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體現優點/ Advantage
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運輸方式
Transportation
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采用彈性皮帶運輸
Elastic belt transport
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運輸更平緩,柔和.可以減少類似像卡位騎馬式運輸硬接觸所帶來硅片破碎率
Transport steady. Can reduce wafer broken rate arising from transport hard contact.
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刮刀下降方式
Scraper way down
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步進馬達+氣缸
Stepper motor + Cylinder
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采用步進馬達+氣缸方式,無需手動調節刮刀印刷高度,只需在軟件里調節,更方便.而且可以根據絲網的張力變化,根據經驗值,讓刮刀的下降值跟隨絲網的變化值,更實用.
Use stepper motor and cylinder, no need manual adjustment of squeegee printing height, only adjust on the software, more convenient. According to changing of screen tension and empirical value, descend value of squeegee will follow screen change, more practical.
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印刷方式
Printing
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采用雙邊驅動
Bilateral driver
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采用雙邊龍門式驅動印刷,可以印刷更平穩.
Bilateral gantry type driver printing, more stable.
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取像方式
Take photo
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采用四相機照取硅片邊緣
Take photo for wafer edge by 4 cameras
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采用四相機照取硅片邊緣,可以減小硅片尺寸誤差所帶來印刷偏向問題,從而可以更好地為雙印刷提供保證
Take photo for wafer edge by 4 cameras can avoid printing deviation problem caused by wafer size error, that could be ensured double printing effect.
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調整方式
Adjustment
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平臺調整方式,非絲網調整
Platform adjustment mode, non-screen adjustment
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調整平臺可以更有效地保證柵線印刷的一致性
Adjust platform can ensure consistency of grid line printing effectively.
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